Hybrid chips, also known as multi-chip modules, are integrated circuits made up of multiple components. There are a variety of synonyms for hybrid chips, each with their own connotations and usage. Some common alternatives include system-in-package, SiP devices, and stacked chips. System-in-package emphasizes the integration of multiple components into a single package, while SiP devices highlights the use of a packaging approach to achieve greater functionality. Stacked chips, on the other hand, focus on the physical stacking of the components within the chip. Other names for hybrid chips include chip-on-board, chip-on-flex, and chip-on-glass. Each of these terms provide a different perspective on what these versatile electronic components can do.